? semiconductor components industries, llc, 2011 july, 2011 ? rev. 0 1 publication order number: EMI5204MU/d EMI5204MU, emi5206mu, emi5208mu four-six-eight-channel emi filter with integrated esd protection the emi520xmu series are a 4, 6, 8 ? channel (c ? r ? c) pi ? style emi filter array with integrated esd protection. its typical component values of r = 100 and c = 7 pf deliver a cutoff frequency of 250 mhz and stop band attenuation greater than 20 db from 800 mhz to 5.0 ghz. this performance makes the part ideal for parallel interfaces with data rates up to 167 mbps in applications where wireless interference must be minimized. the specified attenuation range is very effective in minimizing interference from 2g/3g, gps, bluetooth ? and wlan signals. the emi520xmu series is available in the low ? profile 4, 6, 8 ? lead, 0.5mm thick udfn packages with 0.4mm lead pitch. features/benefits ? 8.0 kv esd protection on each channel (iec61000 ? 4 ? 2 level 4, contact discharge) ? r/c values of 100 and 7 pf deliver exceptional s21 performance characteristics of 250 mhz f 3db and 20 db stop band attenuation from 800 mhz to 5.0 ghz ? integrated emi/esd system solution in udfn package offers exceptional cost, system reliability and space savings ? this is a pb ? free device applications ? emi filtering for lcd and camera data lines ? emi filtering and protection for i/o ports and keypads figure 1. electrical schematic figure 2. typical insertion loss curve see table 1 for pin description c d = 7 pf c d = 7 pf r=100 filter + esd n filter + esd n ? 40 ? 35 ? 30 ? 25 ? 20 ? 15 ? 10 ? 5 0 1e+6 10e+6 100e+6 1e+9 10e+9 frequency (hz) s21 (db) udfn8 case 517bc marking diagrams http://onsemi.com udfn12 case 517bd udfn16 case 517be 1 8 54 m 1 xx = specific device code m = date code = pb ? free package (*note: microdot may be in either location) 1 12 1 56 m 1 16 1 58 m see detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. ordering information
EMI5204MU, emi5206mu, emi5208mu http://onsemi.com 2 figure 3. pin diagram (bottom view) 1234 85 6 7 EMI5204MU gnd 123456 7 8 9 10 11 12 gnd emi5208mu 12345678 9 10 11 12 13 14 15 16 gnd emi5206mu table 1. functional pin description filter device pins description EMI5204MU emi5206mu emi5208mu filter 1 1 & 8 1 & 12 1 & 16 filter + esd channel 1 filter 2 2 & 7 2 & 11 2 & 15 filter + esd channel 2 filter 3 3 & 6 3 & 10 3 & 14 filter + esd channel 3 filter 4 4 & 5 4 & 9 4 & 13 filter + esd channel 4 filter 5 5 & 8 5 & 12 filter + esd channel 5 filter 6 6 & 7 6 & 11 filter + esd channel 6 filter 7 7 & 10 filter + esd channel 7 filter 8 8 & 9 filter + esd channel 8 ground pad gnd gnd gnd ground maximum ratings parameter symbol value unit esd discharge iec61000 ? 4 ? 2 contact discharge v pp 8.0 kv operating temperature range t op ? 40 to 85 c storage temperature range t stg ? 55 to 150 c maximum lead temperature for soldering purposes (1.8 in from case for 10 seconds) t l 260 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. electrical characteristics (t j = 25 c unless otherwise noted) parameter symbol test conditions min typ max unit maximum reverse working voltage v rwm 5.0 v breakdown voltage v br i r = 1.0 ma 6.0 7.0 8.0 v leakage current i r v rwm = 3.3 v 100 na resistance r a i r = 10 ma 85 100 115 diode capacitance c d v r = 2.5 v, f = 1.0 mhz 7.0 11 pf line capacitance c l v r = 2.5 v, f = 1.0 mhz 14 22 pf 3 db cut ? off frequency (note 1) f 3db above this frequency, appreciable attenuation occurs 250 mhz 1. 50 source and 50 load termination.
EMI5204MU, emi5206mu, emi5208mu http://onsemi.com 3 theory of operation the emi520x combines esd protection and emi filtering conveniently into a small package for today?s size constrained applications. the capacitance inherent to a typical protection diode is utilized to provide the capacitance value necessary to create the desired frequency response based upon the series resistance in the filter. by combining this functionality into one device, a large number of discrete components are integrated into one small package saving valuable board space and reducing bom count and cost in the application. application example the accepted practice for specifying bandwidth in a filter is to use the 3 db cutoff frequency. utilizing points such as the 6 db or 9 db cutoff frequencies results in signal degradation in an application. this can be illustrated in an application example. a typical application would include emi filtering of data lines in a camera or display interface. in such an example it is important to first understand the signal and its spectral content. by understanding these things, an appropriate filter can be selected for the desired application. a typical data signal is pattern of 1?s and 0?s transmitted over a line in a form similar to a square wave. the maximum frequency of such a signal would be the pattern 1 ? 0 ? 1 ? 0 such that for a signal with a data rate of 100 mbps, the maximum frequency component would be 50 mhz. the next item to consider is the spectral content of the signal, which can be understood with the fourier series approximation of a square wave, shown below in equations 1 and 2 in the fourier series approximation. from this it can be seen that a square wave consists of odd order harmonics and to fully construct a square wave n must go to infinity. however, to retain an acceptable portion of the waveform, the first two terms are generally suf ficient. these two terms contain about 85% of the signal amplitude and allow a reasonable square wave to be reconstructed. therefore, to reasonably pass a square wave of frequency x the minimum filter bandwidth necessary is 3x. all on semiconductor emi filters are rated according to this principle. attempting to violate this principle will result in significant rounding of the waveform and cause problems in transmitting the correct data. for example, take the filter with the response shown in figure 4 and apply three different data waveforms. to calculate these three different frequencies, the 3 db, 6 db, and 9 db bandwidths will be used. equation 1: x(t) 1 2 2 a n 1 1 2n 1 sin ( 2n 1 ) 0 t (eq. 1) equation 2 (simplified form of equation 1): x(t) 1 2 (eq. 2) 2 sin 0 t 1 p20 sin 3 0 t 3 p20 sin 5 0 t 5 magnitude (db) frequency (hz) 100k 1m 100m 1g 10g 10m ? 3 db ? 6 db ? 9 db figure 4. filter bandwidth f 1 f 2 f 3 from the above paragraphs it is shown that the maximum supported frequency of a waveform that can be passed through the filter can be found by dividing the bandwidth by a factor of three (to obtain the corresponding data rate multiply the result by two). the following table gives the bandwidth values and the corresponding maximum supported frequencies and the third harmonic frequencies.
EMI5204MU, emi5206mu, emi5208mu http://onsemi.com 4 table 2. frequency chart bandwidth maximum supported frequency third harmonic frequency 3 db ? 100 mhz 33.33 mhz (f 1 ) 100 mhz 6 db ? 200 mhz 66.67 mhz (f 2 ) 200 mhz 9 db ? 300 mhz 100 mhz (f 3 ) 300 mhz considering that 85% of the amplitude of the square is in the first two terms of the fourier series approximation most of the signal content is at the fundamental (maximum supported) frequency and the third harmonic frequency. if a signal with a frequency of 33.33 mhz is input to this filter, the first two terms are suf ficiently passed such that the signal is only mildly affected, as is shown in figure 5a. if a signal with a frequency of 66.67 mhz is input to this same filter, the third harmonic term is significantly attenuated. this serves to round the signal edges and skew the waveform, as is shown in figure 5b. in the case that a 100 mhz signal is input to this filter, the third harmonic term is attenuated even further and results in even more rounding of the signal edges as is shown in figure 5c. the result is the degradation of the data being transmitted making the digital data (1?s and 0?s) more difficult to discern. this does not include effects of other components such as interconnect and other path losses which could further serve to degrade the signal integrity. while some filter products may specify the 6 db or 9 db bandwidths, actually using these to calculate supported frequencies (and corresponding data rates) results in significant signal degradation. to ensure the best signal integrity possible, it is best to use the 3 db bandwidth to calculate the achievable data rate. input waveform output waveform a) frequency = f 1 b) frequency = f 2 c) frequency = f 3 figure 5. input and output waveforms of filter input waveform output waveform input waveform output waveform ordering information device package shipping ? EMI5204MUtag udfn8 (pb ? free) 3000 / tape & reel emi5206mutag udfn12 (pb ? free) 3000 / tape & reel emi5208mutag udfn16 (pb ? free) 3000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
EMI5204MU, emi5206mu, emi5208mu http://onsemi.com 5 package dimensions udfn8, 1.7x1.35, 0.4p case 517bc ? 01 issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.25 mm from the terminal tip. 4. coplanarity applies to the exposed pad as well as the terminals. a b e d d2 e2 bottom view b e 8x 0.10 b 0.05 a c c k 8x note 3 2x 0.10 c pin one reference top view 2x 0.10 c 8x a a1 (a3) 0.05 c 0.05 c c seating plane side view l 8x 1 8 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.13 ref b 0.15 0.25 d 1.70 bsc d2 1.10 1.30 e 1.35 bsc e2 0.30 0.50 e 0.40 bsc k 0.15 ??? l 0.20 0.30 detail b 1.40 0.25 0.50 1.55 0.40 pitch dimensions: millimeters 0.40 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 1 package outline l1 ??? 0.05 8x a1 a3 ?? ?? 8x
EMI5204MU, emi5206mu, emi5208mu http://onsemi.com 6 package dimensions udfn12, 2.5x1.35, 0.4p case 517bd ? 01 issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.25 mm from the terminal tip. 4. coplanarity applies to the exposed pad as well as the terminals. a b e d d2 e2 bottom view b e 12x 0.10 b 0.05 a c c k note 3 2x 0.10 c pin one reference top view 2x 0.10 c 12x a a1 (a3) 0.05 c 0.05 c c seating plane side view l 12x 1 6 7 12 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.13 ref b 0.15 0.25 d 2.50 bsc d2 1.90 2.10 e 1.35 bsc e2 0.30 0.50 e 0.40 bsc k 0.15 ??? l 0.20 0.30 2.20 12x 0.25 12x 0.50 1.55 0.40 dimensions: millimeters 0.40 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. recommended detail b ?? ??? 0.05 note 4 detail a pitch soldering footprint* package outline
EMI5204MU, emi5206mu, emi5208mu http://onsemi.com 7 package dimensions udfn16, 3.3x1.35, 0.4p case 517be ? 01 issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.25 mm from the terminal tip. 4. coplanarity applies to the exposed pad as well as the terminals. a b e d d2 e2 bottom view b e 16x 0.10 b 0.05 a c c k note 3 2x 0.10 c pin one reference top view 2x 0.10 c 16x a a1 (a3) 0.05 c 0.05 c c seating plane side view l 16x 1 8 9 16 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.13 ref b 0.15 0.25 d 3.30 bsc d2 2.70 2.90 e 1.35 bsc e2 0.30 0.50 e 0.40 bsc k 0.15 ??? l 0.20 0.30 3.00 16x 0.25 16x 0.50 1.55 0.40 dimensions: millimeters 0.40 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. recommended detail b ?? ??? 0.05 note 4 detail a pitch soldering footprint* package outline on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 EMI5204MU/d bluetooth is a registered trademark of bluetooth sig. literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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